General

• Active Devices NOT Mechanically or Electrically Damaged by processing
• Any shape required–shape complexity is not a limitation
• No hard tooling or non-recurring engineering charge
• No tooling impact for design changes
• Fast delivery of any custom shape or size
• Economical small lot quantities

Types

• Optoelectronic Detectors
• Die Placement Templates
• Shadow Masks

Uses

• Down Sizing of Silicon Wafers
• Excising non-rectangular devices
• Reactive Ion Etcher Gas Metering Electrodes

Materials

• Silicon Wafers
• Any Dopant or Crystal Orientation
• Silicon Carbide
• Piezo Ceramics

Typical Down sizing Application